集(ji)成(cheng)電(dian)(dian)(dian)(dian)路芯片(pian)(pian)(pian)(pian)有哪些(xie)?哪些(xie)芯片(pian)(pian)(pian)(pian)可(ke)回(hui)收?首先我(wo)們來了解一(yi)(yi)下集(ji)成(cheng)電(dian)(dian)(dian)(dian)路芯片(pian)(pian)(pian)(pian)是(shi)(shi)什(shen)么(me),1.芯片(pian)(pian)(pian)(pian)就是(shi)(shi)半導體(ti)元件(jian)(jian)產品的統稱。是(shi)(shi)集(ji)成(cheng)電(dian)(dian)(dian)(dian)路的載體(ti),由晶圓分割而成(cheng)。2.集(ji)成(cheng)電(dian)(dian)(dian)(dian)路芯片(pian)(pian)(pian)(pian)是(shi)(shi)包括一(yi)(yi)硅基(ji)板、至少一(yi)(yi)電(dian)(dian)(dian)(dian)路、一(yi)(yi)固定封環、一(yi)(yi)接地(di)環及至少一(yi)(yi)防護環的電(dian)(dian)(dian)(dian)子元件(jian)(jian)。3.IC芯片(pian)(pian)(pian)(pian)是(shi)(shi)將大量的微(wei)電(dian)(dian)(dian)(dian)子元器件(jian)(jian)(晶體(ti)管、電(dian)(dian)(dian)(dian)阻、電(dian)(dian)(dian)(dian)容、二極管等)
形成(cheng)的集(ji)成(cheng)電(dian)(dian)(dian)(dian)路放在一(yi)(yi)塊塑基(ji)上,做成(cheng)一(yi)(yi)塊芯片(pian)(pian)(pian)(pian)。
集成電路芯片(pian)分類
集成電(dian)(dian)路的分類方(fang)法(fa)很多,依照電(dian)(dian)路屬模(mo)擬或數(shu)(shu)字(zi),可(ke)以分為:模(mo)擬集成電(dian)(dian)路、數(shu)(shu)字(zi)集成電(dian)(dian)路和混合信號集成電(dian)(dian)路(模(mo)擬和數(shu)(shu)字(zi)在一個芯片(pian)上(shang))。
數字(zi)集(ji)成電(dian)路可以(yi)包含任何東西,在(zai)幾平方毫米上有從(cong)幾千到百萬(wan)的邏輯門(men)、觸發器(qi)、多任務(wu)器(qi)和(he)其他電(dian)路。這些(xie)(xie)電(dian)路的小(xiao)尺寸(cun)使得與板(ban)級集(ji)成相比,有更高速度(du),更低功(gong)耗(參見低功(gong)耗設計(ji))并降(jiang)低了制造成本。這些(xie)(xie)數字(zi)IC,以(yi)微(wei)處理(li)器(qi)、數字(zi)信號(hao)處理(li)器(qi)和(he)微(wei)控制器(qi)為代表,工作中使用(yong)二進制,處理(li)1和(he)0信號(hao)。
模擬(ni)集成電(dian)路(lu)有(you),例如傳(chuan)感器、電(dian)源控制電(dian)路(lu)和(he)運放,處理模擬(ni)信號。完成放大、濾波、解調、混頻(pin)的(de)功能等。通過使用專家所設(she)計(ji)(ji)、具有(you)良好特性的(de)模擬(ni)集成電(dian)路(lu),減輕了電(dian)路(lu)設(she)計(ji)(ji)師的(de)重擔,不需(xu)凡事再(zai)由(you)基(ji)礎的(de)一個個晶體管(guan)處設(she)計(ji)(ji)起。
集成(cheng)電路(lu)(lu)可(ke)以把模(mo)擬(ni)和(he)數字電路(lu)(lu)集成(cheng)在一個單芯片(pian)上,以做(zuo)出(chu)如(ru)模(mo)擬(ni)數字轉換器(qi)和(he)數字模(mo)擬(ni)轉換器(qi)等(deng)器(qi)件。這種電路(lu)(lu)提供更小(xiao)的(de)尺寸(cun)和(he)更低(di)的(de)成(cheng)本(ben),但是對(dui)于信(xin)號沖突必須小(xiao)心(xin)。
兩(liang)種常(chang)見的分(fen)類方法(fa)
如(ru)按照制造工藝分類可分為:
這(zhe)種分類(lei)可能最常(chang)見,我們平時(shi)經常(chang)聽到7nm芯片(pian)(pian),14nm芯片(pian)(pian)等(deng)(deng)等(deng)(deng),都是(shi)按(an)照(zhao)這(zhe)個(ge)工藝來分的(de)。對于(yu)上面(mian)這(zhe)個(ge)例子(zi)來講,類(lei)似于(yu)上面(mian)例子(zi)中土豆(dou)絲的(de)直徑(jing)。7nm芯片(pian)(pian)表示(shi)的(de)是(shi)這(zhe)個(ge)土豆(dou)絲的(de)直徑(jing)有(you)7nm(只(zhi)是(shi)舉例子(zi),不要太(tai)較真),14nm芯片(pian)(pian)就(jiu)是(shi)土豆(dou)絲的(de)直徑(jing)有(you)14nm。所(suo)以就(jiu)有(you)了(le)7nm芯片(pian)(pian)制(zhi)造(zao)了(le)數字(zi)芯片(pian)(pian),制(zhi)造(zao)了(le)CPU,GPU等(deng)(deng)等(deng)(deng)。
如按照使用功能(neng)分類(lei)可(ke)分為:
這(zhe)種分(fen)類方式是(shi)也(ye)是(shi)大家最(zui)常見的(de)(de),比如GPU,CPU,FPGA,DSP,ASIC,SOC等等,都是(shi)按照(zhao)這(zhe)個分(fen)類方式分(fen)類的(de)(de)。放到上面的(de)(de)例子(zi)就是(shi)我(wo)們吃的(de)(de)是(shi)土(tu)豆絲(si)(GPU),強調的(de)(de)是(shi)“絲(si)”,不(bu)是(shi)“土(tu)豆塊”(CPU),土(tu)豆泥(FPGA)。關于上面幾(ji)種芯片的(de)(de)具體分(fen)別,擼主會單(dan)獨寫一篇文章來說明。大家在這(zhe)里只(zhi)需要了(le)解(jie)這(zhe)個分(fen)類方式就可以(yi)了(le)。
目前哪些芯片(pian)可回收
超(chao)興(xing)勝電(dian)子可回收(shou)一系列芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian),其中(zhong)包括:手(shou)機(ji)ic芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)回收(shou)(蘋果、麒麟、海思、聯發科、驍(xiao)龍、Exynos等(deng)(deng)等(deng)(deng)),電(dian)腦芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)回收(shou)(CPU(中(zhong)央處理器(qi))芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)、BIOS芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)、CMOS芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)、芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)組(包括南橋和北(bei)橋)、MCH(內(nei)存控(kong)制器(qi)中(zhong)心(xin))、ICH(輸(shu)入/輸(shu)出(chu)控(kong)制器(qi)中(zhong)心(xin))、FWH(固(gu)件控(kong)制器(qi))、I/O芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)、集成(cheng)顯(xian)卡(ka)芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)、集成(cheng)網卡(ka)芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)、集成(cheng)聲(sheng)卡(ka)芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)等(deng)(deng)等(deng)(deng))。集成(cheng)電(dian)路芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)有哪些(xie)?哪些(xie)芯(xin)(xin)(xin)(xin)(xin)(xin)片(pian)(pian)(pian)可回收(shou)?內(nei)容就到這里,希望能(neng)夠(gou)幫助到大家。